Issue #107, September 2016

Last week marked the 2016 Edition of ISMA-the International Conference on Noise and Vibration Engineering-at the Catholic University of Leuven, Belgium. The Modal Shop was in attendance alongside our colleagues from PCB Piezotronics. The conference and exhibition always offer an excellent opportunity to see the current status of the modal test community, with attendees from various commercial, university, and government labs. Conferences and seminars are such an important part of continuing education for our community - what's on your schedule for the end of this year?
The Status of TEDS - IEEE 1451.4
By Mike Dillon, Product Group Manager


Click below to learn more about the basics of IEEE Standard 1451.4 - the international standard for self-identifying sensors.  This self-identification has some fundamental characteristics: it is digital, it works with non-TEDS sensors by its mixed mode implementation, and it is standardized. We'll review these characteristics and also give an update on the evolution of this standard.


Click here to watch video
Tip of the Month 
Stud Considerations


Mounting studs can sometimes be the source of a drastic error. It is most common to use a stud with a shoulder (or flange) at the center to ensure that the stud does not bottom out in either the accelerometer or the mounting hole. Bottoming out can produce strain-induced errors. Take care though that any accelerometer and mounting hole have the proper countersink (or recess) to fully accommodate the thickness of the stud's shoulder. A small but excess tolerance error of only a few thousandths of an inch can cause a gap between the mating surfaces, which has an extremely adverse effect on the accelerometer's frequency response at mid and high frequencies.



Blast from the Past:
Miniature Sensors for Testing Small Structures



CD Drive
Most dynamics people think of structural testing as the system vibration study of large structures like automobiles, aircraft or civil structures. However, the ever increasing push for smaller, lighter, and more powerful in the mobile electronics world (phones, disk drives, subnotebooks, etc) creates a unique set of challenges for structural test engineers. First and foremost is often simply finding space to locate a response accelerometer! This article discusses a number of other specialized measurement considerations for ultra-small or ultra-light test structures...
Thanks for joining us for another issue of Dynamic Sensors & Calibration Tips. As always, please speak up and let us know what you like. We appreciate all feedback: positive, critical or otherwise. Take care!



TMS 25 Years
Sincerely,

Aaron Goosman - Eric Seller - Mike Dillon - Patrick Timmons - Shannon Henize


Calibration Team
The Modal Shop, Inc.

A PCB Group Company

[email protected]
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